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Journal of Dental Research
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*AMMONIA
*SILVER COMPOUNDS
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Electric-current-assisted Application of Self-etch Adhesives to Dentin

L. Breschi1,*, A. Mazzoni2, D.H. Pashley4, G. Pasquantonio3, A. Ruggeri2, P. Suppa2, G. Mazzotti2, R. Di Lenarda1 and F.R. Tay4

1 Division of Dental Sciences and Biomaterials, Department of Biomedicine, University of Trieste, Via Stuparich, 1, I-34125 Trieste, Italy;
2 Department of SAU & FAL, University of Bologna, Italy;
3 Department of Dental Sciences, University of Tor Vergata, Rome, Italy; and
4 Department of Oral Biology, School of Dentistry Medical College of Georgia, Augusta, GA, USA


Figure 1
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Figure 1. Microtensile bond strengths obtained by application of the adhesives to the 2 halves of the same tooth, with the electric-impulse-assisted application technique or with the control bonding protocol recommended by the manufacturers. Premature failures due to preparation procedures were not included in the statistical analysis. {dagger}Values are mean ± standard deviation [number of premature failed sticks/number of intact sticks tested]. Groups with the same superscripts are not statistically different (p > 0.05).

 

Figure 2
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Figure 2. FE-SEM micrographs of bonded interfaces in Xeno III showing presence of silver grains, a manifestation of nanoleakage. The electric-impulse-assisted application technique (a) revealed small clusters of silver grains with a diameter of 3–6 µm within the hybrid layer (pointers); dentin (D), hybrid layer (H), adhesive (A), and composite (C). Conversely, with the control application technique (b), nanoleakage was extensively distributed along the interfaces, with major clusters occurring at the tubule orifices. The insert (B) depicts a back-scattered image of the same area, confirming the elemental composition of the deposits. A high-magnification view, showing the nanoleakage expression of Xeno III associated with the use of the electric-current-assisted application technique (c), and control (d), showing a preferential distribution of aggregates of silver grains along exposed collagen fibrils. Dentin (D), adhesive (A), composite (C).

 

Figure 3
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Figure 3. FE-SEM micrographs of bonded interfaces in Adper Prompt L-Pop that were created by application of the adhesives with the experimental electric-assisted technique (a,c), or in accordance with the manufacturers’ instructions (b,d). Sites within the hybrid layer (H), with extensive silver deposits, corresponded with areas with extensive nanoleakage within the hybrid of the control specimen (B). A preferential localization of the silver deposits at the tubule orifices, while electricity reduced nanoleakage within the hybrid layer (A). A high-magnification view showing silver grains within the hybrid layer created with the use of the electric-assisted application. (D) A high-magnification image taken from a region with extensive nanoleakage, showing exposed collagen fibrils within the hybrid layer that were affiliated with silver grains (pointers) following control application. Dentin (D).

 

Figure 4
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Figure 4. FE-SEM micrographs of bonded interfaces in Clearfil Protect Bond that were created by application of the adhesive with the experimental electric-assisted technique (a,c), or in accordance with the manufacturers’ instructions (b,d). Differences in number and dimension of silver deposits between test and control were lower than in simplified self-etching adhesives. Hybrid layer created under the effect of electric current revealed almost no silver deposits along the interface (A). Controls showed small clusters of silver grains with a diameter of 0.5–2 µm, mainly localized at the peritubular level, and apparently localized within areas of different electron density, probably due to phase separation (B). High-magnification views reveal a similar phenomenon also occurring in test specimens (C), while scattered silver deposits were fond homogenously within the adhesive layer of both test and control groups (D). Dentin (D), adhesive (A).

 

Journal of Dental Research, Vol. 85, No. 12, 1092-1096 (2006)
DOI: 10.1177/154405910608501205


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