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Transient and Residual Stress in a Porcelain-Metal Strip

Department of Dental Engineering, School of Dentistry, Tokushima University, Tokushima, Japan

J.A. Tesk

Dental and Medical Materials, Polymers Division, National Institute of Standards and Technology, Gaithersburg, Maryland 20899

Porcelain-fused-to-metal (PFM) restorations may develop cracks during processing or in-mouth service if the relative physico-mechanical properties of the porcelain and metal are highly mismatched. Precise conditions when this might occur are not known. Many processing and property variations can affect the stresses developed throughout a porcelain-metal system. To understand this, we conducted a computer simulation of stress developed in a PFM beam. The simulation considers cooling from temperatures higher than the porcelain sag-point. The following temperature-dependent factors were incorporated: the elastic modulus, shear viscosity (porcelain), and coefficients of thermal expansion. The cooling rate dependencies of the glass transition temperature, (T_g), and the temperature distribution during cooling were also included.

The results suggest that transient tensile stress at the porcelain alloy interface may result in cracks in the porcelain during cooling. Occlusal forces may set up stresses to cause cracking at the surface of the porcelain if the compressive residual stress is not high enough. PFM restorations with an alloy of high thermal expansion coefficient require rapid cooling; on the contrary, PFM restorations with the alloys of lower coefficients require slow cooling. A high cooling rate can make up for thermal expansion mismatches between the alloy and the porcelain up to 2 x 10^-6/°C. Finally, the results indicated that curvature was not a sensitive indication of stress for a multimaterial beam when visco-elastic relaxation and high cooling rates are involved. For the case modeled here, curvature varied inversely with a 1/2 to 1/7th power of the stress.

Journal of Dental Research, Vol. 69, No. 2, 463-469 (1990)
DOI: 10.1177/00220345900690020901


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