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Thermal Stress Failure of Porcelain Bonded to a Palladium-Silver Alloy

T.R. Walton

University of Michigan, School of Dentistry, Ann Arbor, Michigan 48109

W.J. O'Brien

University of Michigan, School of Dentistry, Ann Arbor, Michigan 48109

Cracking or rupturing, due to thermal stress, of porcelain bonded to a palladium-silver alloy indicated that porcelain-metal thermal compatibility was dependent on: the difference in thermal expansion coefficients of the porcelain and metal; the geometry and dimensions of the samples; and the porcelain-metal thickness ratio. A spherical configuration was more sensitive to thermal expansion coefficient differences than was a disc configuration. A higher incidence of cracking resulted from an increase in both specimen size and porcelain-metal thickness ratio.

Journal of Dental Research, Vol. 64, No. 3, 476-480 (1985)
DOI: 10.1177/00220345850640031801
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